| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can be used even in an environment that the board is exposed to a corrosive fluid. SOLUTION: The wiring board (1) includes: a substrate (2) including alumina; a via conductor (3) which is formed in the substrate (2), also exposes the end to a surface of the substrate (2), and includes molybdenum or tungsten; a thin film (4) including an active metal formed on the surface of the substrate (2) so as to cover the end; and a conductor layer (5) formed on the thin film (4) and including platinum. COPYRIGHT: (C)2010,JPO&INPIT |
