| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module package that is free from warpage caused after a metal plate is joined to a metal frame, even if using as a bottom plate the metal plate, which is composed of metals having high thermal conductivity chosen from copper, aluminum, silver and their alloys, and to provide a method of manufacturing the same. SOLUTION: The package includes: a thermoelectric module 10a, wherein a plurality of thermoelectric elements 17 are serially connected by a pair of electrode plates 14 and 15; a metal bottom plate 11 to which one electrode plate 14 of this thermoelectric module 10a is joined through an insulating resin layer 13; and a metal frame 12 joined to the periphery of this metal bottom plate 11 with a solder 18. Meanwhile, the metal bottom plate 11 is composed of metals chosen from copper, aluminum, silver and their alloys; and the metal bottom plate 11 is joined to the metal frame 12 with the solder 18, whose melting point is equal to or lower than those of solders 16a and 16b used for forming the thermoelectric module 10a. COPYRIGHT: (C)2010,JPO&INPIT |
