| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board which prevents permeation of chemical to the mating surface during the process and prevents delamination even after high temperature treatment. SOLUTION: The method of manufacturing the printed circuit board includes a step of stacking two sets of structure, each having a metal foil applied to one side of a laminate consisting of a predetermined number of prepregs, through a mold release material so that the laminate of prepregs is located on the inside and for hot pressing them to produce a 2-ply laminate board which is clad with metal foil on one side, a step of carrying out multilayer treatment for the metal foil surface of the 2-ply laminate board which is clad with metal foil on one side by forming a circuit, treating the inner layer and performing interlayer connection, a step of stripping the mold release material, and a step of forming a circuit on the surface of the multilayered outermost layer and the surface from which the mold release material is stripped. COPYRIGHT: (C)2010,JPO&INPIT |
