| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device for improving I/O throughput and reducing power consumption or reducing cost. <P>SOLUTION: A semiconductor integrated circuit device is provided wherein, for example, a plurality of semiconductor chips CHIP0-CHIPn are laminated and packaged and data transmitting/receiving terminals P-DIO are mutually bus-connected through a through-via TSV. Among power supply voltages of internal core circuits of CHIP0-CHIPn, a lowest power supply voltage is used to transmit/receive data via the bus. With the data transmission/reception, a CHIPn power supply voltage terminal P_VDDn, that is brought to the lowest power supply voltage, is connected through the through-via TSV to power supply voltage terminals P_VDDL0, P_VDDL1 of data transmitting/receiving circuits of the other semiconductor chips CHIP0, CHIP1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
