| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device including a semiconductor element covered with a high heat conductive resin and a method of manufacturing the semiconductor device. <P>SOLUTION: The method of manufacturing a semiconductor device includes the steps of preparing a circuit board 2 having a mounting region and a peripheral region adjacent to the mounting region, mounting a semiconductor element 1 on the mounting region, covering the side of the semiconductor element 1 and the peripheral region with a first resin 3b, and covering the surface of the semiconductor element 1 exposed from the first resin 3b and the first resin 3b with a second resin 3a. The first resin 3b has higher flowability than the second resin 3a. The second resin 3a has higher heat conductivity than the first resin 3b. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
