| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board in which the size precision of wiring formed on an insulating resin layer can be prevented from decreasing, in a step of forming a protective resin layer by bonding a coverlay film through thermocompression. SOLUTION: The method of manufacturing the circuit board 11 includes the steps of: forming a first laminate 10a comprising a metallic sheet type support member 1 reinforcing the insulating resin layer 3, the insulating resin layer 3, and the wiring 7 in this order; forming the protective resin layer 9 on the wiring 7 by bonding the coverlay film through the thermocompression; and separating the sheet type support member 1 from the insulating resin layer 3 after forming the protective resin layer 9. In the step of forming the protective resin layer 9, the sheet type support member 1 functions as a pattern size precision maintaining means for maintaining the size precision of the wiring 7. COPYRIGHT: (C)2010,JPO&INPIT |
