SOLDER BALL, AND ELECTRONIC MEMBER HAVING SOLDER BUMP

摘要

PROBLEM TO BE SOLVED: To provide a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having high drop impact resistance required in mobile devices or the like, and having a melting temperature of <250°C. SOLUTION: The solder ball contains substantially not less than 40% by mass of Sn and has the melting temperature of <250°C, the surface being coated with a boron-containing layer containing boron. COPYRIGHT: (C)2010,JPO&INPIT