| 摘要 |
A semiconductor package includes at least: a workpiece at least one surface of which is equipped with a device; a wall portion provided along an outer circumference of the device and is spaced apart from the device; and a cover member that is arranged above the device so as to form a first space and is supported by the workpiece via the wall portion, in which the first space includes at least one second space that communicates with an external space.
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