| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a suspension substrate in which variation in thickness of wide-width wiring and insulation parts is small. SOLUTION: The method of manufacturing the suspension substrate including wide-width wiring lamination structure having a fist insulating part, a first wide-width wiring formed on the first insulating part, a second insulating part formed on the first wide-width wiring, and a second wide-width wiring formed on the second insulating part. The method has: a multilayer substrate preparing process for preparing a multilayer substrate having a metal substrate, a first insulating layer and a first conduction layer; a first wide-width wiring forming process for etching the first conduction layer and forming the first wide-width wiring; a second insulating part forming process for forming the second insulating part on the surface of the first wide-width wiring on which the wide-width wiring lamination structure is formed; and a second wide-width wiring forming process for forming the second wide-width wiring on the surface of the second insulating part. COPYRIGHT: (C)2010,JPO&INPIT
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