| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which is reduced in size, structured to additionally mount an electronic component such as a chip component therein and stabilizes connection with the electronic component. Ž<P>SOLUTION: The electronic device 10 includes first and second flexible substrates 20, 40 and a built-in electronic component 100 accommodated between the first and second flexible substrates 20, 40. On one side surface of the first flexible substrate 20, an electronic component mounting electrode 22 is formed and on the other side thereof, a first internal electrode 24 is formed. The electronic component mounting electrode 22 and the first internal electrode 24 are electrically connected by a via-hole 26 formed on the first flexible substrate 20. On one side surface of the second flexible substrate 40, a second internal electrode 42 is formed, the first internal electrode 24 and the second internal electrode 42 are connected by a conductive connecting member 60, and between the first flexible substrate 20 and the second flexible substrate 40, a resin member 70 is formed for covering the built-in electronic component 100 and the connecting member 60. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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