| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate connecting external devices such as external memories of a semiconductor integrated circuit with a plurality of dies vertically laminated from dies other than the most upper surface or the most lower surface. <P>SOLUTION: Each laminated die has an inter-die communication part for mutually conducting data-communication with dies vertically arranged, and a bonding pad capable of connecting by the wire bonding between the dies and a package substrate. The inter-die communication part is arranged in a physical position capable of mutually connecting vertical dies even the die itself is rotated. A pad for external communication is arranged apart from the physical position with the inter-die communication part arranged, even when a plurality of dies are rotated and overlapped, the pads for external communication do not overlap with other dies to be exposed, and the pads for external communication of the whole dies and the package substrate are connected by the wire bonding. <P>COPYRIGHT: (C)2010,JPO&INPIT |
