| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing leakage of sticking agents used for sticking semiconductor elements to the outside, and to provide a method of manufacturing the semiconductor device. <P>SOLUTION: The semiconductor device 10 includes: the semiconductor element 18 including electrodes disposed on a main surface; a lead 12A electrically connected to the semiconductor element 18 and partially led to the outside; and an encapsulating resin 24 integrally covering the semiconductor element 18 and the lead 12A. A tab 20 continues via a slender connection section 22, and is exposed outside from the encapsulating resin 24. An island 14 and the periphery of the connection section 22 project in a thickness direction to form a projection 30. Also, the upper surface of the connection section 22 is recessed to provide a stepped portion 38, and the stepped portion 38 reaches the projection 30 provided at both the sides of the connection section 22. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
