发明名称 SUSPENSION SUBSTRATE WITH CIRCUIT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit, which is made compact and has high connection reliability, while density of first and second terminals can be suppressed low. <P>SOLUTION: The suspension substrate 1 with a circuit is equipped with a conductor pattern 7. The conductor pattern 7 is provided to include: a head side terminal 16 which is provided on a surface of the suspension substrate 1 with the circuit and electrically connected with a magnetic head 38; and a component side terminal 22 which is provided on a back surface of the suspension substrate 1 with the circuit and electrically connected with an electronic device 40. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010108575(A) 申请公布日期 2010.05.13
申请号 JP20080282165 申请日期 2008.10.31
申请人 NITTO DENKO CORP 发明人 OSAWA TETSUYA;ABE ISATO;YOSHIDA YOSHINARI
分类号 G11B5/60;G11B21/21;H05K1/11 主分类号 G11B5/60
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