| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate and a mounting structure that meet a demand for improvement in electric reliability. <P>SOLUTION: The wiring substrate 2 has a base 5 formed by laminating a plurality of fiber layers 8 including a plurality of single fibers 9 and resin 10 covering the single fibers 9, and a conductive layer 7 formed on the base 5. The plurality of fiber layers 8 have first fiber layers 8a in which a plurality of single fibers 9 expanded in parallel to a first direction and second fiber layers 8b in which a plurality of single fibers 9 are woven in a second direction and a third direction, and the top layer among the plurality of fiber layers 8 is formed of a second fiber layer 8b. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
