| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a test chamber capable of testing a semiconductor device efficiently under a more accurate temperature condition. Ž<P>SOLUTION: A temperature adjusting means includes: a preheating part 50 for preheating each socket board SB on which each semiconductor device D is mounted; a temperature keeping means (duct 100) communicated with the preheating part 50, for keeping the temperature inside each test unit U1-U5 equally to the preheating part 50; and a heat removing part 60 for removing heat from each socket board SB on which each inspected semiconductor device D is mounted. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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