发明名称 TEMPERATURE CONTROLLER FOR MOLDING DIE DEVICE, AND MOLDING DIE SYSTEM
摘要 PROBLEM TO BE SOLVED: To shorten a molding cycle and to enhance quality of a molding, by controlling a temperature of a molding die to a proper temperature. SOLUTION: This temperature controller includes a heater temperature control part 32, and a molding die temperature control part 33. The heater temperature control part 32 controls temperatures of a plurality of heater units 17 movable along directions contacting with and separated from the molding die 7, in response to positions of the plurality of heater units 17 arranged with respect to the molding die 7. The molding die temperature control part 33 controls the contact and the separation of the plurality of heater units 17 arranged with respect to the molding die, to control a temperature of the molding die 7. Resultingly, the temperature of the molding die 7 is controlled properly by individually controlling respectively the temperatures of the plurality of heater units 17 arranged in the molding die. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010105363(A) 申请公布日期 2010.05.13
申请号 JP20080282395 申请日期 2008.10.31
申请人 SHIBATA GOSEI:KK 发明人 KIRYU HIDEYUKI
分类号 B29C33/02;B29C45/73 主分类号 B29C33/02
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