| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for electrical device insulation, which reduces dripping from a coil, exhibits a good impregnation property, and reduces attachment on a core even when the resin composition for electrical device insulation is exposed to a high temperature by preheat of the electrical device after drop treatment; and to provide an electrical device electrically insulated by using the resin composition for electrical device insulation. SOLUTION: The resin composition for electrical device insulation has viscosity of 10-500 mPa s at 80°C, and stracker fixing strength of 300N or higher. The resin composition preferably contains: (A) 10-50 pts.mass of unsaturated epoxy ester resin obtained by making polyepoxide react with α, β-unsaturated basic acid, and further making the reactant react with unsaturated dibasic acid; (B) 1-50 pts.mass of dicyclopentenyl oxyethyl methacrylate with respect based on 10-50 pts.mass of the (A) component; (C) 0-30 pts.mass of tris(2-acryloyl oxyethyl)isocyanurate based on total 100 pts.mass of the (A) and (B) components; and (D) 10-200 pts.mass of acrylate or methacrylate having trifunctionality or higher based on the total 100 pts.mass of the (A) and (B) components. COPYRIGHT: (C)2010,JPO&INPIT |
