APPARATUS AND METHOD FOR PLATING BOTH SIDES OF SUBSTRATE

摘要

PURPOSE: A device and a method for plating both sides of a printed circuit board are provided to reduce material waste by preventing the thickness of a plating layer formed in a printed circuit board from thickened. CONSTITUTION: A device for plating both sides of a printed circuit board is composed of a pair of anodes(31,33), an interval controller(50), and a jig(70). The anodes are faced each other in a plating bath. A printed circuit board(20) is formed between the anodes. The interval controller independently controls an interval between the anodes. The jig is coupled to the top end of the printed circuit board, and fixes the printed circuit board.