发明名称 ELECTRONIC SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic substrate configured to efficiently dissipate heat produced in a coil formed by a circuit pattern of a substrate. <P>SOLUTION: A DC-DC converter 100 includes heat dissipating members 161 to 163 formed so as to dissipate heat to a cooling section 103 from the side of one end. The heat dissipating members 161 to 163 are arranged so that one end thereof comes into contact with the cooling section 103 with a thermally conductive insulation sheet 102 sandwiched therebetween. The other end of each of the heat dissipating members 161 to 163 is connected to each of wiring circuits 152 to 154, respectively. Due to this, it becomes possible to dissipate heat that propagates on the wiring circuits 152 to 154 to the cooling section 103 via the heat dissipating members 161 to 163. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010109309(A) 申请公布日期 2010.05.13
申请号 JP20080311389 申请日期 2008.12.05
申请人 FURUKAWA ELECTRIC CO LTD:THE;FURUKAWA AUTOMOTIVE SYSTEMS INC 发明人 TORATANI TOMOAKI;HASHIMOTO KYOSUKE;KIHARA YASUSHI;ORITO HIROSHI;HIRAYAMA SACHIYUKI;MORII KEISUKE
分类号 H05K7/20;H05K1/16;H05K3/46 主分类号 H05K7/20
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