发明名称 HEAT TRANSPORT ASSEMBLY
摘要 The invention relates to a heat transport assembly comprising a first part being a plastic part and a second part, and having a first surface area on the first part in heat conductive contact with a second surface area on the second part, wherein the first surface area and the second surface area consist of a surface material having a heat conductivity of at least 50 W/m-K.
申请公布号 US2010118495(A1) 申请公布日期 2010.05.13
申请号 US20080524613 申请日期 2008.01.29
申请人 JANSSEN ROBERT H C;KOENEN JACOB;VAN VEHMENDAHL FRANCISCUS 发明人 JANSSEN ROBERT H.C.;KOENEN JACOB;VAN VEHMENDAHL FRANCISCUS
分类号 H05K7/20;F28F7/00 主分类号 H05K7/20
代理机构 代理人
主权项
地址
您可能感兴趣的专利