A METHOD AND APPRATUS FOR CASCADE SEMICONDUCTOR WAFER DRYING USING SURFACE TENSION GRADIENT

摘要

PURPOSE: A method and an apparatus for drying a cascade semiconductor wafer are provided to remove particles from the surface of the semiconductor wafer using the surface tension gradient between deionized water and a protic polar solvent gas. CONSTITUTION: A semiconductor wafer(10) is arranged on a horizontal plane with a pre-set angle. A deionized water supply device(20) supplies deionized water from the upper side of the semiconductor wafer toward both side of the semiconductor wafer. A protic polar solvent gas is supplied to the both side of the semiconductor wafer. The deionized water on the both side of the semiconductor wafer is substituted to the protic polar solvent due to surface tension gradient between the deionized water and the protic polar solvent gas.