发明名称 SUBSTRATE CUTTING APPARATUS AND CUTTING METHOD OF SUBSTRATE
摘要 PURPOSE: A device and a method for cutting a substrate are provided to prevent a crack on a separated corresponding cell by stably separating a cell from a basic substrate. CONSTITUTION: A scriber forms a scribe line along an arrangement direction of cells on a basic substrate. A first substrate separation unit(410) lifts the corresponding cell to be separated from the basic substrate to a first direction. A second substrate separation unit(420) is arranged on the peripheral region of the corresponding cell along the scribe line. The second substrate separation unit pushes the peripheral region of the corresponding cell to a second direction opposite to the first direction.
申请公布号 KR20100046786(A) 申请公布日期 2010.05.07
申请号 KR20080105799 申请日期 2008.10.28
申请人 SEMES CO., LTD. 发明人 YANG, JIN HYUCK
分类号 H01L21/301;H01L21/78 主分类号 H01L21/301
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