METHOD FOR PROCESSING SUBSTRATE OF SEMICONDUCTOR MANUFACTURING EQUIPMENT

摘要

PURPOSE: A method for processing a substrate is provided to rapidly deal with an error by easily grasping the kind of errors of the substrate inputted to the semiconductor manufacturing facility. CONSTITUTION: The error of a substrate inputted to a process module is sensed. Information related to the detected error is compared with first to fourth wafer errors(S20). One wafer error matched with the detected error is marked on a display unit(S30). The first to fourth wafer errors are marked on the display unit with different icons. The errors of the wafer are grasped through the icons displayed on the display unit. A wafer error is rapidly recovered corresponding to the error(S40).