A DUAL FACE PACKAGE AND A FABRICATING METHOD FOR THE SAME

摘要

PURPOSE: A double sided electrode package and a manufacturing method thereof are provided to prevent a resin compound material from being hardened by manufacturing an upper substrate using a molding process or supporter. CONSTITUTION: A penetration electrode(146a) is connected to a die pad. A lower rewiring layer(148) is connected to the penetration electrode. An insulation layer includes a penetration electrode connected to a post electrode(134). The insulation layer includes the upper rewiring layer connected to the post electrode on one side. An adhesive layer is formed on one side of the semiconductor substrate and attaches the insulation layer to the semiconductor substrate when the penetration electrode is connected to the post electrode.