| 摘要 |
PURPOSE: An apparatus and a method for processing a silicon carbide wafer cut waste are provided to prevent a secondary pollution by distilling, separating, and recovering waste water contained in a liquid waste, polyethylene glycol, and waste oil contained in liquid waste. CONSTITUTION: A solid waste is separated from a liquid waste(10). The waste water among the liquid waste is separated with a thin film evaporation method(13). The polyethylene glycol is separated from the separated waste water with a thin film evaporation method(14). The waste oil component of the residual liquid waste of the separated polyethylene glycol is separated with the molecule distillation method and is packed(15). The waste oil residue is divided.
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