| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device reduced in warpage by increasing the balance in thermal expansion of both surfaces of a wiring board. <P>SOLUTION: The semiconductor device is characterized by comprising the wiring board 2 having a connection pad 3 on one surface 2a and a plurality of lands 4 electrically connected with the connection pad 3 on the other surface 2b, at least one or more semiconductor chip(s) 5 mounted on the surface 2a of the wiring board 2, an electrode pad 6 provided on the semiconductor chip 5, a wire 7 electrically connecting the electrode pad 6 with the connection pad 3, a first sealant 11 of an insulating resin covering at least the semiconductor chip 5, the wire 7 and the surface 2a of the wiring board 2 and a second sealant 12 of an insulating resin covering the other surface 2b of the wiring board 2. <P>COPYRIGHT: (C)2010,JPO&INPIT |
