SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To increase a yield of a semiconductor device and to simplify a manufacturing process in the semiconductor device and a manufacturing method of the device.

SOLUTION: A plurality of pad electrodes 12 are formed in a prescribed region on a surface of a semiconductor substrate 10, and a supporting body 15 is bonded to the surface of the semiconductor substrate 10 through an adhesive layer 14. An opening part 10A is formed in a region overlapped with the prescribed region in the semiconductor substrate 10. Wiring layers 18 which are electrically connected to respective pad electrodes 12 in the opening part 10A are formed. A laminated body including the semiconductor substrate 10 and the supporting body 15 is diced along a dicing line DL extending outside the opening part 10A through a prescribed process.

COPYRIGHT: (C)2010,JPO&INPIT