| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning method capable of preventing pattern collapse. SOLUTION: The substrate cleaning method for cleaning and removing particles P that adhere on the surface of a wafer W has a heating step of heating the wafer W to peel the particle P, adhering on the surface of the wafer W by a thermal stress from the surface of the wafer W; a desorption step of desorbing the particles P from the surface of the wafer W by the temperature gradient caused near to the surface of the wafer W; and a step of collecting the particles P for collecting the particles P desorbed from the surface of the wafer W by a collecting plate 13 arranged opposite to the wafer W. COPYRIGHT: (C)2010,JPO&INPIT |
