CHIP TYPE FUSE AND ITS MANUFACTURING METHOD

摘要

A chip type fuse comprises a ceramics substrate (1), a first metal layer (2), a second metal layer (4), a protection layer (5), back electrodes (6) and terminal electrodes (8, 9). An insulating layer (3) is formed between the first metal layer (2) and the second metal layer (4), and the temperature of softening point of the insulating layer (3) is between the temperatures of softening points of the first metal layer (2) and the second metal layer (4). A manufacturing method for the chip type fuse comprises: forming the back electrodes (6) on the backside of the substrate (1); forming the first metal layer (2) over the upper surface of the substrate (1) according to shape of a melt; adhering a metal mesh to the substrate (1) with two ends of the first metal layer (2) shielded, depositing the insulating layer (3) over the first metal layer (2) by vapor deposition; removing the metal mesh, printing the second metal layer (4) over the insulating layer (3) by screen printing; covering the protective layer (5) on the upper surface of the substrate (1) except area at the terminal electrodes (8, 9); and forming the terminal electrodes (8, 9).