OPTICAL ELEMENT, OPTICAL ELEMENT WAFER, OPTICAL ELEMENT WAFER MODULE, OPTICAL ELEMENT MODULE, METHOD OF MANUFACTURING OPTICAL ELEMENT MODULE, ELECTRON DEVICE WAFER MODULE, METHOD OF MANUFACTURING ELECTRONIC DEVICE MODULE, ELECTRONIC ELEMENT MODULE, AND ELECTRONIC INFORMATION DEVICE

摘要

PROBLEM TO BE SOLVED: To maintain clean surface of an optical element, such as, the surface of a convex lens that functions optically.

SOLUTION: An annular top flat surface (flat surface of an annular projection 61a) of an edge at the outer-peripheral side of the surface of the convex lens is provided at a position higher than a high position at the center of the surface of the convex lens in a first lens 61, at a side opposite to the side of an image pickup device 2. Although conventionally, a force is applied in a direction for peeling off a cutting holding tape 9 on the convex lenses, the cutting holding tape 9 is stuck to the top flat surface (a flat surface of the annular projection 61a) at the edge for reception, thus preventing stress from being applied to the cutting holding tape 9, there is no cutting of the holding tape 9 from being readily peeled off, the paste of the cutting holding tape 9 from adhering to the surface of the convex lens, and the surface of the convex lens from being stained by the entry of cutting water into the cutting holding tape 9.

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