| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, which exhibits good adhesion to noble metals such as Ag and Au, good reflow resistance and flame retardancy, without reducing reliability of moldability, moisture resistance, high-temperature exposure properties or the like, and to provide an electronic part device including elements sealed with the same. Ž<P>SOLUTION: The epoxy resin composition for sealing contains (A) an epoxy resin, and (B) a curing agent, wherein the curing agent (B) is represented by formula (I), wherein R<SP>1</SP>is selected from 1C-6C alkyl and 1C-2C alkoxy and may be the same or different from one another, n represents an integer of 0-10. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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