发明名称 HEAT-CONDUCTIVE FILLER-CONTAINING POLYMERIZABLE COMPOSITION, PREPREG, AND LAYERED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a polymerizable composition useful for manufacturing of a layered product being extremely excellent in heat-conductivity and being excellent in high frequency characteristic, fine wire burying property, heat-resistance and anti-crack property at a cold heat impact test, a prepreg and a layered product. SOLUTION: The polymerizable composition contains a cycloolefin monomer, a polymerization catalyst, a crosslinking agent, a reactive flowing agent, crosslinking auxiliaries ad a heat-conductive filler. A dry film obtained by polymerizing the polymerizable composition, the prepreg obtained by polymerizing the polymerizable composition after a reinforced fiber is impregnated with it, and the layered product having a layer comprising the dry film and/or a cured article of the prepreg are provided. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010100685(A) 申请公布日期 2010.05.06
申请号 JP20080271435 申请日期 2008.10.21
申请人 NIPPON ZEON CO LTD 发明人 KOJIMA KIYOSHIGE;MATSUO TAKATOSHI
分类号 C08G61/08;C08J5/24;C08K3/00;C08K5/00;C08L65/00;H05K1/03 主分类号 C08G61/08
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