发明名称 IMAGE SENSOR WITH BACKSIDE PHOTODIODE IMPLANT
摘要 An array of pixels is formed using a substrate. Each pixel can be formed on the substrate, which has a backside and a frontside that includes metalization layers. A photodiode is formed in the substrate and frontside P-wells are formed using frontside processing that are adjacent to the photosensitive region. A first N-type region is formed in the substrate below the photodiode. A second N-type region is formed in a region of the substrate below the first N-type region and is formed using backside processing.
申请公布号 US2010109060(A1) 申请公布日期 2010.05.06
申请号 US20080266314 申请日期 2008.11.06
申请人 OMNIVISION TECHNOLOGIES INC. 发明人 MAO DULI;VENEZIA VINCENT;TAI HSIN-CHIH;QIAN YIN;RHODES HOWARD E.
分类号 H01L31/18;H01L27/146 主分类号 H01L31/18
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