| 摘要 |
A semiconductor device comprises: a semiconductor chip having a first electrode on one face; a circuit board having a second electrode on a mounting face; a warp suppressing layer to suppress a warp of at least the semiconductor chip; and a stress relaxing layer to relax stress arising between the semiconductor chip and the warp suppressing layer. The semiconductor chip is mounted on the circuit board so as to electrically connect the first electrode with the second electrode of the circuit board and to oppose the one face to the mounting face: the stress relaxing layer is provided on a back face of the one face in the semiconductor chip; the warp suppressing layer is laminated on the semiconductor chip via the stress relaxing layer; the stress relaxing layer has a spacer to maintain a predetermined gap between the semiconductor chip and the warp suppressing layer; the stress relaxing layer has a Young's modulus lower than that of the warp suppressing layer; and the stress relaxing layer and the warp suppressing layer have coefficients of linear expansion greater than that of the semiconductor chip.
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