COMPOSITE STAMP FOR EMBOSSING

摘要

A method of manufacturing a composite stamp (24) for embossing comprises the steps of: (a) taking a master structure (10) having a conductive surface (16) and dielectric features (18) thereon; (b) depositing an opaque material on exposed regions of the conductive surface (16) to form an opaque mask (20); (c) coating the dielectric features (18) and opaque mask (20) with a fluid material (4) which is capable of being transformed to a form-retaining material; (d) causing or permitting the fluid material (4) to be transformed to a form-retaining material which is bonded to the opaque mask (20); and (e) removing the form-retaining material (4) and bonded opaque mask (20) from the master structure (10) to provide the composite stamp (24). Other aspect of the invention provide a composite stamp (24) and a composite structure (22) for making the composite stamp.