| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wire bonding method for further reducing the height of a wire loop, and to provide a semiconductor device. <P>SOLUTION: After forming a bonding ball 23 and a ball neck 25 by joining an initial ball to a pad 13, a capillary 41 is raised and then moved in a direction opposite to that of a lead, and then is lowered and the ball neck 25 is stamped down by a face section 43 at the lead side. Then, the capillary 41 is raised and is moved toward the lead until the face section 43 is on the ball neck 25, and the wire 21 is folded. Then, the capillary 41 is lowered and the side of the wire folded on the ball neck 25 that has been stamped down is pressed by the capillary 41. After that, the capillary 41 is moved in an oblique upper portion toward the lead and then is looped for crimping the wire 21 to the lead for joining. <P>COPYRIGHT: (C)2010,JPO&INPIT |
