| 发明名称 |
WIRING BOARD AND METHOD OF MANUFACTURING SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board and a method of manufacturing the same facilitating positioning to surely prevent generation of a connection failure in mounting an electronic component on the wiring board. <P>SOLUTION: The wiring board 1 includes a metal bump 4 formed on the electronic component 3, a recessed part 5 which is formed in a wiring board 2 having a wiring pattern and into which the metal bump 4 is fitted and a metal plated layer 6 formed to cover an inner surface of the recessed part 5 to connect the metal bump 4 with the wiring pattern. In manufacturing the wiring board 1, the metal bump 4 is formed on the electronic component 3 and the recessed part 5 is formed in the wiring board 2 having the wiring pattern. Then the metal plated layer 6 covering the inside of the recessed part 5 is formed to connect the metal plated layer 6 and the wiring pattern. Then, the electronic component 3 is superposed and pressed on the wiring board 2 to fit the metal bump 4 into the recessed part 5 to connect the electronic component 3 with the wiring pattern. <P>COPYRIGHT: (C)2010,JPO&INPIT |
| 申请公布号 |
JP2010103344(A) |
申请公布日期 |
2010.05.06 |
| 申请号 |
JP20080274179 |
申请日期 |
2008.10.24 |
| 申请人 |
HAKODATE ELECTRONICS CO LTD;CLOVER DENSHI KOGYO KK |
发明人 |
IHAYAZAKA SHIGEKAZU;KUROSU MASAAKI;OGASAWARA MASARU;MIYAMA KATSUMI |
| 分类号 |
H05K3/46;H01L21/60;H01L23/12;H05K1/18;H05K3/34 |
主分类号 |
H05K3/46 |
| 代理机构 |
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