| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device high in reliability and durability and a method of manufacturing the same. <P>SOLUTION: The semiconductor device is the semiconductor device 1 in which a semiconductor chip 20 is nip-held in a gap between a mounting substrate 10 and a lid 40. A chip protection material 50 of a frame body form is disposed on the inner side of an outer peripheral region between the mounting substrate 10 and the lid 40 in the vicinity of the outer periphery of the semiconductor chip 20 to protect the semiconductor chip 20 from a stress on the semiconductor chip 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
