| 摘要 |
Disclosed is a highly reliable thermoelectric module that has an excellent bonding between a metal bonding layer and thermoelectric elements and that is capable of suppressing displacement occurrence of the thermoelectric elements even when the metal bonding layer softens due to heat generated by the thermoelectric elements. The thermoelectric module (10) is equipped with multiple thermoelectric elements (2), an electrode (3) that electrically bonds adjacent thermoelectric elements (2), and a metal bonding layer (4) that connects the electrode (3) to the bonding faces of the thermoelectric elements (2). The metal bonding layer (4) contains multiple metallic particles (5), and an intermediate layer (6), which includes a metallic component included in the metal bonding layer (4) and a component included in the metallic particles (5), is formed on the surfaces of the metallic particles (5). The intermediate layer (6) serves to suppress slippage of the metal bonding layer (4) with respect to the metal particles (5) even if the metal bonding layer (4) softens in response to the heat generated by the thermoelectric elements (2), so the thermoelectric module (10) can suppress the displacement occurrence of the thermoelectric elements (2) and has high durability.
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