| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high yield and small semiconductor package capable of preventing the electrostatic discharge damage across a plurality of chips and suppressing noises among the chips. <P>SOLUTION: The semiconductor package includes: a first semiconductor chip; a first internal circuitry that operates on the voltage given between a first high potential side power supply terminal and a first low potential side power supply terminal in the first semiconductor chip; a second semiconductor chip; a second internal circuit that operates on the voltage given between a second high potential side power supply terminal and a second low potential side power supply terminal in the second semiconductor chip; and a first electrostatic protective circuit in which one end is connected to a node located between the first internal circuit and the first low potential side power supply terminal and the other end is connected to a node located between the second internal circuit and the second low potential side power supply terminal, formed in the first semiconductor chip. <P>COPYRIGHT: (C)2010,JPO&INPIT |
