| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize a semiconductor device reducing a warpage of a semiconductor chip and ensuring the strength of the semiconductor chip. <P>SOLUTION: The semiconductor device 100 includes the semiconductor chip 17 with an integrated circuit formed, a rewiring layer 3 disposed on a surface of the semiconductor chip 17 on which the integrated circuit is formed and a resin embedded part 9 formed on a surface of the semiconductor chip 17 opposed to the integrated circuit formed surface. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
