| 摘要 |
<P>PROBLEM TO BE SOLVED: To shorten a time required to manufacture a MEMS (Micro Electro Mechanical Systems) sensor. Ž<P>SOLUTION: In a silicon microphone 1, a through hole 3 is formed in a substrate 2, and a diaphragm 7 is arranged facing the through hole 3. The diaphragm 7 is formed in such a manner that the size of the diaphragm 7 is smaller than that of the through hole 3 when seen in the direction of facing the through hole 3. The diaphragm 7 is supported by a plurality of support parts 8 extending from its circumferential edge up to the outside of the circumferential edge of the through hole 3. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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