发明名称 |
TEMPERATURE-COMPENSATED MICRO-ELECTROMECHANICAL DEVICE, AND METHOD OF TEMPERATURE COMPENSATION IN A MICRO-ELECTROMECHANICAL DEVICE |
摘要 |
A micro-electromechanical device includes a semiconductor substrate, in which a first microstructure and a second microstructure of reference are integrated. The first microstructure and the second microstructure are arranged in the substrate so as to undergo equal strains as a result of thermal expansions of the substrate. Furthermore, the first microstructure is provided with movable parts and fixed parts with respect to the substrate, while the second microstructure has a shape that is substantially symmetrical to the first microstructure but is fixed with respect to the substrate. By subtracting the changes in electrical characteristics of the second microstructure from those of the first, variations in electrical characteristics of the first microstructure caused by changes in thermal expansion or contraction can be compensated for.
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申请公布号 |
US2010107391(A1) |
申请公布日期 |
2010.05.06 |
申请号 |
US20100683888 |
申请日期 |
2010.01.07 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
LASALANDRA ERNESTO;MERASSI ANGELO;ZERBINI SARAH |
分类号 |
H01G7/00;G01C19/56;G01C19/5755;G01P15/18 |
主分类号 |
H01G7/00 |
代理机构 |
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主权项 |
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地址 |
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