发明名称 |
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A chip package including a plurality of conductive bodies and a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer over the molding compound contacts with the conductive bodies disposed on the substrate, and the shielding layer and the conductive bodies function as EMI shield. The shielding layer is electrically grounded through the conductive bodies connected to the laminate substrate and the ground plane of the substrate.
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申请公布号 |
US2010110656(A1) |
申请公布日期 |
2010.05.06 |
申请号 |
US20090388771 |
申请日期 |
2009.02.19 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
KO DONGKYUN;LEE JUNG;AN JAESUN |
分类号 |
H05K9/00 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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