| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component built-in substrate manufactured at a low cost by a simple method. <P>SOLUTION: The method includes the steps of mounting a chip-shaped electronic component 5 having a connection pad C and a metal protection layer 14 formed on the entire surface, covering the pad, with the connection pad C directed upward, embedding the electronic component 5 in an insulating layer 42, working the insulating layer 42 in a thickness direction to leave the insulating layer 42 on a side of the electronic component 5 and to expose the metal protection layer 14 of the electronic component 5, and forming an upper wiring layer 34 including an in-chip wiring part 35 connected with the connection pad C, formed in contact with an upper surface of the electronic component 5 and constituted of a base metal pattern layer 14x formed by patterning the metal protection layer 14 and a conductive pattern layer 34x and an extended wiring part 36 formed in connection with the in-chip wiring part 35 and constituted of the same layer as the conductive pattern layer 34x. <P>COPYRIGHT: (C)2010,JPO&INPIT |
