| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic member with a solder bump, which has high falling shock characteristics that a mobile device such as a cellular phone, a digital camera, and a notebook-sized personal computer requested to have, at a solder junction using solder alloy used for connections of electronic equipment. SOLUTION: The electronic member has the solder bump formed using the alloy containing boron, Ag, and Cu, the alloy containing≥0.1 to≤200 ppm, by mass, of boron,≥0.1 to≤3.0%, by mass, of Ag,≥0.01 to≤1.5%, by mass, of Cu, and the balance substantially Sn and inevitable impurities thereof, wherein the average sectional thickness of a region where a void formed on a junction interface of the solder bump for an electrode of the electronic member is present is≥0.01 to <0.1μm. COPYRIGHT: (C)2010,JPO&INPIT |
