| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor adhesive sheet which can be sufficiently bonded in a short time, can be embedded in uneven portions of a substrate in molding, and can be reduced in thickness, and to provide a dicing integrated semiconductor adhesive sheet using the same. Ž<P>SOLUTION: A storage modulus of the semiconductor adhesive sheet by dynamic viscoelasticity measurement at 150°C after curing is 6 MPa or more, and 5 MPa or less at 170°C. Alternatively, the semiconductor adhesive sheet includes an adhesive layer of which adhesive after curing at 150°C for 2 minutes is 0.1 MPa or more after thermal compression of a silicon wafer. The dicing integrated semiconductor adhesive sheet is formed by laminating the semiconductor adhesive sheet and a dicing tape. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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