发明名称 PROGRAMMABLE RESISTIVE MEMORY CELL WITH FILAMENT PLACEMENT STRUCTURE
摘要 Programmable metallization memory cells having a first metal contact and a second metal contact with an ion conductor solid electrolyte material between the metal contacts. The first metal contact has a filament placement structure thereon extending into the ion conductor material. In some embodiments, the second metal contact also has a filament placement structure thereon extending into the ion conductor material toward the first filament placement structure. The filament placement structure may have a height of at least about 2 nm.
申请公布号 US2010110759(A1) 申请公布日期 2010.05.06
申请号 US20080263562 申请日期 2008.11.03
申请人 SEAGATE TECHNOLOGY LLC 发明人 JIN INSIK;HUTCHINSON CHRISTINA;LARSON RICHARD;STOVER LANCE;NAM JAEWOO;HABERMAS ANDREW
分类号 G11C11/00;G11C11/34;H01L21/00;H01L21/4763;H01L29/76;H01L47/00 主分类号 G11C11/00
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