THERMOPLASTIC COMPOSITON INCLUDING THERMALLY CONDUCTIVE FILLER AND HYPERBRANCHED POLYESTERAMIDE

摘要

Disclosed is a thermoplastic composition including at least one semi-aromatic polyamide having a glass transition equal to or greater than 100° C. and a melting point of equal to or greater than 280° C.; a thermally conducting filler having a thermal conductivity of at least 5 W/mK, for instance CaF2 powder; and at least one hyperbranched polyesteramide having terminal hydroxy groups; and molded articles made therefrom.