发明名称 |
Heat sink system with fin structure |
摘要 |
A heat sink apparatus includes a heat conductive base plate and a plurality of fins in thermal communication with the heat conductive base plate. The plurality of fins is configured to form a plurality of curved and branching channels extending radially on the base plate. At least two of the plurality of fins are configured with a gap between them to trip a gas boundary layer formed on a first one of the at least two fins, when a gas boundary layer is present.
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申请公布号 |
US2010108292(A1) |
申请公布日期 |
2010.05.06 |
申请号 |
US20080290505 |
申请日期 |
2008.10.31 |
申请人 |
TELEDYNE SCIENTIFIC & IMAGING, LLC |
发明人 |
BHUNIA AVIJIT;ZHAO YUAN;CHEN CHUNG-LUNG |
分类号 |
F28F7/00 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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