发明名称 Heat sink system with fin structure
摘要 A heat sink apparatus includes a heat conductive base plate and a plurality of fins in thermal communication with the heat conductive base plate. The plurality of fins is configured to form a plurality of curved and branching channels extending radially on the base plate. At least two of the plurality of fins are configured with a gap between them to trip a gas boundary layer formed on a first one of the at least two fins, when a gas boundary layer is present.
申请公布号 US2010108292(A1) 申请公布日期 2010.05.06
申请号 US20080290505 申请日期 2008.10.31
申请人 TELEDYNE SCIENTIFIC & IMAGING, LLC 发明人 BHUNIA AVIJIT;ZHAO YUAN;CHEN CHUNG-LUNG
分类号 F28F7/00 主分类号 F28F7/00
代理机构 代理人
主权项
地址